Intel LNB32 Thunderbolt controller chip. Kings Creek , a creek at Lassen Peak , California. Contact your OEM or reseller for warranty support. Intel SBT2 server motherboard. The island of Bali in Indonesia.
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This page was last edited on 21 Septemberat Reference unknown; see Geneseo disambiguation for possibilities. Reference unknown; see Brookdale disambiguation for possibilities.
An MP version of Nocona. Deschutes CountyOregon or, more likely, Deschutes Riverwhich runs through it.
List of Intel codenames – Wikipedia
Intel WX58BP workstation motherboard. Based on the Nineven Hartwell controller chip. Taxes and shipping, etc. Intel DP67DE desktop motherboard. First Xeon processor to use the NetBurst microarchitecture.
Intel® MM Gigabit Ethernet PHY Product Specifications
Aimed at high-end smartphones. Probably named after Gainestown, Alabama. Supports the Pentium processor. From Wikipedia, the free encyclopedia. The musician Frank Zappa.
Cancelled and replaced by Caneland. This page was last edited on 3 Novemberat Kings Creeka creek at Lassen PeakCalifornia. Successor to Twin Castle. Statements consisting only of original research should be removed. Successor to the Conroe Core microarchitecture.
Microserver platform built around the Centerton Atom processor. Intel’s “next-generation communications platform,” a scheme for network processing.
Intel® 82566MM Gigabit Ethernet PHY
Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2. Apple Hill is located in Camino.
Reference unknown; see Bloomfield disambiguation for possibilities. Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Probably named after Bridge Creeka creek in Oregon. Possibly named after Red Rock Canyon.
Xeon LC series dual-coreXeon LC series quad-coreand the Celeron P single-coreintended for use in storage controllers paired with the Ibex Peak chipset. Successor to Santa Ontel. Retrieved December 17, System and Maximum TDP is based on worst case scenarios.
The information herein is provided “as-is” and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
The components have thin, small designs and work together to “enable the best mobile computing and Internet experience” on mobile and low-power devices. Prices may vary for other package types and shipment quantities, and itnel promotional arrangements may apply.